Capco Electronics

Capco has over three decades of experience in manufacturing electromechanical devices. These devices require a wide range of electronics assembly techniques, processes, and specialized equipment. Capco has the ability to source components, form leads, solder components to circuit boards (robotic, convective, IR, or by hand) using leaded and RoHS compliant solders, and assemble components into a variety of electro-mechanical devices. Capco has the unique ability to solder components and subassemblies into devices that contain explosive materials. Capco utilizes modern inspection methods, including digital radiography for joint integrity, barrel fill, and strength testing of soldiered joints.

Capco’s electronics expertise includes building Electro Explosive Devices (EED’s) that are resistant to electrostatic discharge and Hazard of Electro-Magnetic Radiation to Ordnance (HERO). Capco works closely with our DoD customers to design and manufacture EED’s that pass and/or exceed DoD HERO testing specifications.


Electronics Capabilities

During the past 40 years, Capco has produced a wide variety of electronic components in support the Army Family of Scatterable Mines, Navy Flare Dispensers, commercial aircraft, deep hole drilling, and air delivered munitions.  Products include, but are not limited to:

  • Antenna Boards
  • Rigid Stripline Sensor
  • Coil and Strap Assembly
  • CEM Board
  • Wing Heaters
  • Anti-disturbance Switch
  • Magnetometer
  • Transmitter Coil
  • Receiver Coil
  • Breechplate
  • Capacitors

Electronics R&D

The Electronic Warfare-Internal Research and Development (EW-IR&D) program at Capco investigates novel countermeasure materials and obscurants, with a specific focus on nanotechnology, special material morphology and materials with unique electromagnetic properties.  To date, this research has allowed Capco scientists and engineers to develop a broad understanding of RF to UV devices (imagers, seeker heads etc.) and has yielded several patent filings. Capco has developed a network of academic consultants/partners, small businesses, and a national laboratory to develop applications for newly patented materials.